EUV optics

    Multilayer Optics for Extreme Ultraviolet Lithography

    High efficiency multilayer optics for 13.5 nm, 6.x nm wavelengths

    Rigaku is the exclusive supplier of Osmic® multilayer coatings and optics for EUV. Based on over 25 year experience developing and supplying X-ray multilayers and optics for high volume industrial and scientific use, our products enable the highest system performance by optimizing the multilayer optical design to the application and source/tool characteristics.

    EUV optics Overview

    Glancing to normal incidence optics for 13.5 nm (EUV)

    EUVL is the current front runner for adoption into high volume manufacturing of memory and logic integrated circuits. Mo/Si multilayers, optimized for EUVL, with protective cap layers of various designs are available from Rigaku for use in collection, beam conditioning pre-reticle for scanners and beam conditioning pre-sample and imaging post-sample for metrology.

    Glancing to normal incidence optics for 6.x nm (BEUV)

    Even as EUVL approaches adoption, the semiconductor industry is investigating next generation tools. Beyond EUV (BEUV) is based on current development of new X-ray sources and associated multilayer optics. Today, we offer the highest performance available for BEUV.

    EUV optics Features

    Optimized multilayer optical design for highest performance available
    High reflectivity ≥65% at 13.5 nm typical (substrate dependent)
    d-spacing profile precision ± 0.05 Å rms
    Sizes: linear 1.5 m x 0.5 m, diameters up to 450 mm
    Standard production materials
    Mo/Si, La/B, La/B₄C, Ru/B₄C, Mo/B4C, W/C, Cr/C, Cr/Sc, Al₂O₃/B₄C, SiC/Si, Si/C, SiC/C, and more

    EUV optics Specifications

    Technique Extreme ultraviolet lithography
    Benefit High efficiency multilayer optics
    Technology Multilayer optics
    Core attributes High reflectivity ≥65% at 13.5 nm typical
    options Standard production materials: Mo/Si, La/B, La/B₄C, Ru/B₄C, Mo/B4C, W/C, Cr/C, Cr/Sc, Al₂O₃/B₄C, SiC/Si, Si/C, SiC/C...

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