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    WaferX 310

    In-Line, Simultaneous WDXRF Spectrometer

    Film thickness and composition measurements on blanket wafers

    Rigaku's WaferX 310 represents the culmination of more than 40 years of experience in the X-ray fluorescence analysis of thin films on silicon wafers. Developed as an in-line metrology tool, it is ideally suited to 300 mm high-volume manufacturing environments.

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    WaferX 310 Overview

    Simultaneous thickness and composition

    The WaferX 310 is ideal for measuring BPSG, PSG and metal films. In addition, thin film BPSG, multilayered circuit film, WSix, electrode films, ferrodielectric thin films, FRAM, next generation DRAM, and SiOF are standard applications for this tool.

    Analysis to support sub-micron technology

    Highly accurate analyses for the ultralight elements such as B and P in BPSG film has been improved significantly by employing a 4kW high power X-ray tube with a super thin window beryllium window.

    Advanced design

    The instrument employs a wafer height adjustment mechanism to compensate for differences in wafer thickness and a diffraction avoidance mechanism to eliminate diffraction interference for the transition metals. Integrated FOUP(SMIF) is available, supporting the C-to-C standard. Various user cassettes can also be loaded. FOUP(SMIF) through-the-wall option is available.

    Software redesign

    • 3D graphics display enables the operator to judge status clearly
    • The alarm position is displayed graphically, and accurate maintenance information is provided to the operator.
    • “Bubble chart” display enables the operator to easily judge the distribution of intensity on a wafer.
    • More flexible parameter setting to avoid X-ray diffraction effects.

    WaferX 310 Features

    Patented "diffraction avoidance" capability for accurate XRF results
    High-sensitivity Boron analysis (with AD-Boron channel)
    Robotic wafer handling and fully automated operation
    Solid-state, oil-free X-ray generator
    FOUP, SMIF, and through-the-wall configurations are available to meet the various needs of high-volume manufacturing wafer fabs
    GEM300 Software
    Auto Calibration

    WaferX 310 Specifications

    Technique Simultaneous wavelength dispersive X-ray fluorescence
    Benefit Thickness and composition of multi-layer stacks for 300 mm and 200 mm wafers
    Technology Process WDXRF with 4 kW sealed Rh X-ray tube
    Attributes Blanket wafer metrology
    20 channels max., fixed type (₄Be ～₉₂U), scanning type (₂₂Ti ～₉₂U)
    AutoCal function
    Features Designed for measurement throughput
    Measurements under vacuum enable light-element sensitivity
    Dual FOUP (SMIF) load ports
    Options Through-the-wall
    High-sensitivity boron detector (AD-Boron)
    GEM300 software, E84/OHT Support
    Dimensions 1200 (W) x 1950 (H) x 2498 (D) mm
    Measurement results Film thickness and composition

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